HP 8200 Microtower Spécifications rapides télécharger pdf (Page 30)

Intel Gigabit CT Desktop Network Interface Controller

Connector

RJ-45

System Interface

PCI Express x1

Controller

Intel WG82574L Gigabit Ethernet Controller

Memory

Integrated Dual 48K configurable transmit receive FIFO Buffers

Data rates supported

10/100/1000 Mbps

Compliance

IEEE 802.1P, 802,1Q, 802.2, 802.3, 802.3AB and 802.3u compliant, 802.3x flow control

Bus architecture

PCI-E 1.0a

Data path width

X1, 250 MB/s, Bi-directional interface

Data transfer mode

Bus-master DMA

Hardware certifications

FCC, B, CE, TUV- cTUVus Mark Canada and United States, TUV- GS Mark for European Union

Power requirement

Aux 3.3V, 3.0 Watts in 1000base-T and 2.0 Watts in 100Base-T

Boot ROM support

Yes

Network Transfer Rate

10BASE-T (half-duplex) 10 Mbps

10BASE-T (full-duplex) 20 Mbps

100BASE-TX (half-duplex) 100 Mbps

100BASE-TX (full-duplex) 200 Mbps

1000BASE-T (full-duplex) 2000 Mbps (actual rate limited by PCI Bus)

Environmental

Operating Temperature:

32° to 131°F (0° to 55° C)

Operating Humidity:

85% at 131° F (55° C)

Dimensions

4.75 x 2.25 x 0.8 in (12.1 x 5.7 x 2.0 cm)

Management

WOL, PXE, DMI, WFM 2.0

HP 802.11 b/g/n Wireless Network Connection

Dimensions

(L x H)

2.8 x 2.2 in (7.0 x 5.7 cm)

Weight

0.08 lbs (40 g)

Controller

Ralink RT2790

System interface

PCI Express x1

Network standard

802.11 b/g/n

Frequency band

2.400 - 2.497 GHz

Operating temperature

14° to 149°F, operating (-10° to 65°C, operating)

Storage temperature

-40° to 176°F, non-operating (-40° to 80°C, non-operating)

Humidity

10-90% operating

5-95% non-operating

Operating voltage

3.3V +/- 9%

12V +/- 8%

QuickSpecs

HP Compaq 8200 Elite Series

Technical Specifications - Communications

DA - 13879 Worldwide — Version 34 — November 26, 2012

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QuickSpecs 1

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