HP Computer Manuel d'utilisateur télécharger pdf (Page 90)

6. Remove the three Phillips PM2.5×5.0 screws (2) and the four Phillips PM2.5×10.0 spring-loaded

screws (3) that secure the heat sink to the system board.

NOTE: Due to the adhesive quality of the thermal material located between the heat sink and

system board components, it may be necessary to move the heat sink from side to side to

detach it.

7. Remove the fan and heat sink (4).

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink

and the system board components each time the heat sink is removed. Replacement

thermal material is included with the base enclosure, heat sink, processor, and system board

spare part kits.

●

Thermal paste is used on the processor (1) and the heat sink section (2) that services it

●

A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that

services it (only on computer models equipped with a graphics subsystem with

discrete memory)

82 Chapter 4 Removal and replacement procedures

1 2 ... 85 86 87 88 89 90 91 92 93 94 95 ... 131 132

Pas de commentaire

HP Computer Manuel d'utilisateur Page 90