HP TouchSmart Informations techniques télécharger pdf (Page 83)

3. Remove the heat sink (2).

NOTE: Steps 4 and 5 apply only to computer models equipped with a UMA graphics

subsystem. See steps 2 and 3 for heat sink removal instructions for computer models equipped

with a discrete graphics subsystem.

4. Following the 1, 2, 3, 4 sequence stamped into each section of the heat sink, loosen the four

Phillips PM2.5×10.0 captive screws (1) that secure the heat sink to the system board.

5. Remove the heat sink (2).

NOTE: Due to the adhesive quality of the thermal material located between the heat sink and

system board components, it may be necessary to move the heat sink from side to side to detach the

assembly.

ENWW Component replacement procedures 75

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HP TouchSmart Informations techniques Page 83