Hp ProLiant BL685c G7 Server-Blade Manuel d'utilisateur Page 35
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Hardware options installation 35
Processor option
The server supports dual- and quad-processor operation. The server supports boot functions through the
processor installed in processor socket 1. However, if processor 1 fails, the system automatically boots
from processor 2 and provides a processor failure message.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To avoid damage to the system board:
• Do not touch the processor socket contacts.
• Always install the processor socket cover after removing the processor from the socket.
• Do not tilt or slide the processor when lowering the processor into the socket.
CAUTION: To avoid damage to the processor:
• Handle the processor only by the edges.
• Do not touch the bottom of the processor, especially the contact area.
CAUTION: To prevent possible server blade malfunction and damage to the equipment,
multiprocessor configurations must contain processors with the same part number.
CAUTION: The server blade supports only two- or four-processor configurations. Always
populate processor sockets 1 and 2 with processors and heatsinks. To prevent overheating,
always populate processor sockets 3 and 4 with processors and heatsinks or processor socket
covers and heatsink blanks.
CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the
heatsink is removed from the processor after it has been installed.
IMPORTANT: Processor sockets 1 and 2 must always be populated. If either processor socket
is empty, the server blade does not power up.
To install a processor:
1. Locate and download the latest ROM version from the HP website (http://www.hp.com/support).
Follow the instructions on the website to update the system ROM.
2. Power down the server blade (on page 14).
3. Remove the server blade (on page 15).
4. Remove the hard drives ("Hot-plug SAS or SATA hard drive option" on page 31).
5. Remove the access panel (on page 16).
- User Guide 1
- Intended audience 2
- Contents 3
- Component identification 6
- SAS and SATA hard drive LEDs 7
- System board components 9
- DIMM slot identification 10
- System maintenance switch 11
- HP c-Class Blade SUV Cable 12
- Item Connector Description 13
- Operations 14
- Remove the server blade 15
- Remove the access panel 16
- Install the access panel 16
- Remove the DIMM baffles 17
- Install the DIMM baffles 17
- Overview 19
- Remove the device bay blank 20
- Setup 21 21
- Setup 24 24
- Connecting to the network 25
- Installing a server blade 26
- Completing the configuration 27
- Introduction 28
- Memory option 28
- DIMM identification 29
- DIMM installation guidelines 30
- DIMM population order 30
- Installing DIMMs 31
- 2. Prepare the hard drive 32
- Mezzanine card option 33
- Processor option 35
- Cabling 45
- USB devices 46
- Item Description 48
- Network-based PXE deployment 50
- Deployment methods 52
- CD-ROM deployment 53
- Diskette image deployment 54
- Configuration tools 55
- HP ROM-Based Setup Utility 56
- Boot options 57
- BIOS Serial Console 57
- Configuring AMP modes 57
- Array Configuration Utility 58
- Management tools 59
- HP Systems Insight Manager 60
- Erase Utility 61
- Redundant ROM support 61
- Internal USB functionality 62
- External USB functionality 62
- Integrated Management Log 63
- Keeping the system current 64
- ProLiant Support Packs 65
- Firmware 65
- HP Smart Update Manager 65
- Care Pack 66
- Troubleshooting 67
- Symbols on equipment 68
- Warnings 68
- Symptom information 69
- Service notifications 70
- Loose connections 70
- Troubleshooting flowcharts 70
- Start diagnosis flowchart 71
- General diagnosis flowchart 72
- Symptoms: 73
- POST problems flowchart 75
- OS boot problems flowchart 77
- • Corrupted OS 78
- • Redundancy failure 80
- Troubleshooting 81 81
- Battery replacement 82
- FCC rating label 83
- Class A equipment 83
- Class B equipment 83
- Modifications 84
- • EMC Directive 2004/108/EC 85
- Japanese notice 86
- BSMI notice 86
- Korean notice 87
- Chinese notice 87
- Laser compliance 87
- Battery replacement notice 87
- (Geräuschemission) 88
- Electrostatic discharge 89
- Specifications 90
- Technical support 91
- Technical support 92 92
- Customer Self Repair 93
- Technical support 94 94
- Reparo feito pelo cliente 95
- Technical support 96 96
- Technical support 97 97
- Technical support 98 98
- Acronyms and abbreviations 99
- Index 101 101
- Index 102 102
- Index 103 103
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