Hp ProLiant BL620c G7 Server-Blade Manuel d'utilisateur télécharger pdf (Page 28)

Setup 28

Two types of interconnect modules are available for HP BladeSystem c-Class enclosures: Pass-Thru modules

and switch modules. For more information about interconnect module options, see the HP website

(http://www.hp.com/go/bladesystem/interconnects).

IMPORTANT: To connect to a network with a Pass-Thru module, always connect the Pass-Thru

module to a network device that supports Gigabit speed.

Installing server blade options

Before installing and initializing the server blade, install any server blade options, such as an additional

processor, hard drive, or mezzanine card.

Installing a server blade

1. Remove the connector covers.

1 2 ... 23 24 25 26 27 28 29 30 31 32 33 ... 122 123

User Guide 1
Contents 3
Contents 4 4
Contents 5 5
Contents 6 6
Component identification 7
SAS and SATA hard drive LEDs 8
System board components 9
System maintenance switch 10
Accessing the redundant ROM 11
DIMM slot locations 12
HP c-Class Blade SUV Cable 12
Item Connector Description 13
Operations 14
Remove the server blade 15
Remove the access panel 16
Install the access panel 16
Remove the left DIMM baffle 17
Remove the right DIMM baffle 18
Remove the battery pack 19
Overview 21
Remove the device bay blank 22
Setup 23 23
Setup 26 26
Connecting to the network 27
Installing a server blade 28
Completing the configuration 29
Introduction 30
Processor option 30
Memory option 36
Dual- and quad-rank DIMMs 37
DIMM identification 37
DIMM installation guidelines 38
Channel Slot Slot number 40
Hemisphere mode 41
Memory RAS 43
HP Memory Quarantine 45
Installing DIMMs 46
Remove the hard drive blank 48
Prepare the hard drive 48
Mezzanine card option 49
Controller options 51
Installing a capacitor pack 53
BitLocker™ enabled 57
Additional TPM features 57
Cabling 58
Item Description 60
Network-based PXE deployment 61
Deployment overview 62
Deployment infrastructure 62
Deployment methods 63
PXE deployment 64
CD-ROM deployment 64
Diskette image deployment 65
SAN configuration 66
Configuration tools 67
HP ROM-Based Setup Utility 68
Boot options 69
BIOS Serial Console 69
Configuring AMP modes 69
Configuring mirrored memory 70
Array Configuration Utility 71
Management tools 72
ROMPaq utility 73
Erase Utility 73
Redundant ROM support 74
Diagnostic tools 75
Keeping the system current 77
Firmware 78
HP Smart Update Manager 78
Care Pack 79
Troubleshooting 80
Warnings 81
Symbols on equipment 81
Symptom information 82
Troubleshooting 83 83
Loose connections 84
Service notifications 84
Server health LEDs 84
Troubleshooting flowcharts 84
Start diagnosis flowchart 85
General diagnosis flowchart 86
Symptoms: 88
POST problems flowchart 90
OS boot problems flowchart 92
• Corrupted OS 93
• Redundancy failure 95
(http://www.hp.com/support) 96
Troubleshooting 97 97
Battery replacement 98
FCC rating label 99
Class A equipment 99
Class B equipment 99
Modifications 100
• EMC Directive 2004/108/EC 101
Japanese notice 102
BSMI notice 102
Korean notice 102
Battery replacement notice 103
Chinese notice 103
Laser compliance 103
Wireless devices 104
Japanese notices 105
Taiwan notices 105
Electrostatic discharge 106
Specifications 107
Technical support 108
Technical support 109 109
Customer Self Repair 110
Technical support 111 111
Reparo feito pelo cliente 112
Technical support 113 113
Technical support 114 114
Technical support 115 115
Acronyms and abbreviations 116
Index 119 119
Index 120 120
Index 121 121
Index 122 122
Index 123 123

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