Hp BL685C Manuel d'utilisateur Page 25
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Hardware options installation 25
Hardware options installation
Introduction
If more than one option is being installed, read the installation instructions for all the hardware options
and identify similar steps to streamline the installation process.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To prevent damage to electrical components, properly ground the server before
beginning any installation procedure. Improper grounding can cause electrostatic discharge.
Hot-plug SAS or SATA hard drive option
The server blade supports up to two hot-plug SAS or SATA drives.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server blade
or the enclosure unless all hard drive and device bays are populated with either a component
or a blank.
To install the component:
1. Remove the hard drive blank.
- User Guide 1
- Audience assumptions 2
- Contents 3
- Contents 4 4
- Contents 5 5
- Component identification 6
- Front panel LEDs 7
- SAS and SATA hard drive LEDs 8
- System board components 9
- Item Description 10
- Item Connector Card support 10
- DIMM slots 11
- System maintenance switch 11
- Accessing the redundant ROM 12
- Local I/O cable 13
- Operations 14
- Remove the access panel 15
- Remove the server blade 15
- Install the access panel 16
- Remove the DIMM baffle 16
- Install the DIMM baffle 16
- Overview 18
- Installing a server blade 19
- Setup 20 20
- 1. Remove the blank 20
- Setup 21 21
- Remove the connector covers 22
- Connecting to the network 24
- Completing the configuration 24
- Introduction 25
- Processor option 26
- 14. Install the heatsink: 32
- Memory option 33
- Advanced ECC memory 34
- DIMM installation guidelines 34
- DIMM population order 34
- Installing DIMMs 34
- Mezzanine card option 35
- Cabling 39
- Network-based PXE deployment 43
- Deployment infrastructure 44
- Deployment methods 45
- CD-ROM deployment 46
- Diskette image deployment 47
- Configuration tools 48
- HP ROM-Based Setup Utility 49
- Auto-configuration process 50
- Boot options 50
- Array Configuration Utility 51
- Management tools 52
- Erase Utility 53
- HP Systems Insight Manager 53
- Management Agents 54
- ProLiant Edition 54
- Redundant ROM support 55
- Diagnostic tools 56
- Integrated Management Log 57
- Array Diagnostic Utility 57
- Keeping the system current 58
- ProLiant Support Packs 59
- Care Pack 59
- Troubleshooting 60
- Symbols on equipment 61
- Warnings 61
- Symptom information 62
- Service notifications 63
- Loose connections 63
- Troubleshooting flowcharts 63
- Start diagnosis flowchart 64
- General diagnosis flowchart 65
- Symptoms: 67
- POST problems flowchart 69
- Item Refer to 70
- OS boot problems flowchart 71
- • Corrupted OS 72
- • Redundancy failure 74
- Troubleshooting 75 75
- Battery replacement 76
- FCC rating label 77
- Class A equipment 77
- Class B equipment 77
- Modifications 78
- • EMC Directive 2004/108/EC 79
- Japanese notice 80
- BSMI notice 80
- Korean notice 81
- Laser compliance 81
- Battery replacement notice 81
- Electrostatic discharge 83
- Specifications 84
- Technical support 85
- Technical support 86 86
- Customer Self Repair 87
- Technical support 88 88
- Reparo feito pelo cliente 89
- Technical support 90 90
- Technical support 91 91
- Technical support 92 92
- Acronyms and abbreviations 93
- Web-Based Enterprise Service 96
- Wired for Management 96
- Index 97 97
- Index 98 98
- Index 99 99
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