Hp DV3 Manuel d'utilisateur télécharger pdf (Page 121)

Removal and replacement procedures

Maintenance and Service Guide 4–59

✎

Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board

components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly.

✎

The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system

board each time the fan/heat sink assembly is removed:

■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it.

■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.

■ Thermal pads are used on the other system board components 5 and sections of the heat sink 6 that

service them.

Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare

part kits.

Reverse this procedure to install the fan/heat sink assembly.

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Hp DV3 Manuel d'utilisateur Page 121