HP dv7-6c20us Informations techniques télécharger pdf (Page 117)

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the

system board each time the heat sink is removed. Thermal paste is used on the processor (1) and the

heat sink section (2) that services it. Thermal pads are used on the Northbridge chip (3), the video

memory chip (4), and the system board capacitors (5), and the sections of the heat sink (6) that service

these components. Replacement thermal material is included with all heat sink assembly, system board,

and processor spare part kits.

The following illustration shows the replacement thermal material locations for computer models

equipped with an AMD processor.

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the

system board each time the heat sink is removed. Thermal paste is used on the processor (1) and the

heat sink section (2) that services it. Thermal pads are used on the Northbridge chip (3), the video

memory chip (4), and the system board capacitors (5), and the sections of the heat sink (6) that service

these components. Replacement thermal material is included with all heat sink assembly, system board,

and processor spare part kits.

The following illustration shows the replacement thermal material locations for computer models

equipped with an Intel processor.

Component replacement procedures 107

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HP dv7-6c20us Informations techniques Page 117