HP E5440 Spécifications télécharger pdf (Page 84)

Heatsink Clip Load Methodology

84 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Alternate Heatsink Sample Preparation

As just mentioned, making sure that the load cells have minimum protrusion out of the

heatsink base is paramount to meaningful results. An alternate method to make sure

that the test setup will measure loads representative of the non-modified design is:

• Machine the pocket in the heatsink base to a depth such that the tips of the load

cells are just flush with the heatsink base.

• Then machine back the heatsink base by around 0.25 mm [0.01”], so that the load

cell tips protrude beyond the base.

Proceeding this way, the original stack height of the heatsink assembly should be

preserved. This should not affect the stiffness of the heatsink significantly.

Figure C-1. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View

Package IHS

Outline (Top

Surface)

Heatsink Base

Pocket

Diameter ~

29 mm

[~1.15”]

Load

Cells