HP E5440 Spécifications Page 89
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- Table des matières
- MARQUE LIVRES
- Quad-Core Intel 1
- Processor 1
- 5400 Series 1
- Contents 3
- Revision History 7
- 1 Introduction 9
- 1.4 Definition of Terms 10
- Introduction 12
- Thermal/Mechanical Reference 13
- Considerations 18
- 2.2.2 Digital Thermal Sensor 20
- 2.2.5 Thermal Profile 24
- Definition 25
- Processor 5400 Series 26
- 2.2.8 Performance Targets 28
- Thermal Profile (2U) 31
- Thermal Profile 31
- Y = 0.187*x + 35 31
- 2.3 Fan Fail Guidelines 32
- Requirements 33
- Relationships 34
- 2.4.2.1 Example 35
- 2.5.3 Summary 38
- Mechanical Design 39
- CASE_MAX_B 43
- CASE_MAX 45
- 1U CEK Reference Solution 45
- Y = 0.246 * X + 40 45
- Y = 0.298 * X + 43.2 45
- Secondary 48
- 2.5.8.1 Fan Power Supply 50
- A1U Alternative Heatsink 53
- Thermal/Mechanical Design 53
- A.3 Thermal Profile Adherence 54
- 1U Alternative Heatsink 55
- Y = 0.331 * X + 40 55
- B Mechanical Drawings 57
- Mechanical Drawings 58
- C Heatsink Clip Load 83
- Methodology 83
- Load Cells (3x) 85
- Preload Fixture (copper 85
- C.2.2 Typical Test Equipment 86
- C.2.3 Test Procedure Examples 86
- D Safety Requirements 89
- Safety Requirements 90
- E Quality and Reliability 91
- FEnabled Suppliers 95
- Information 95
- F.1.2 Additional Suppliers 96
- Enabled Suppliers Information 100
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