Hp ProLiant BL680c G7 Server-Blade Manuel d'utilisateur Page 52
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Hardware options installation 52
Hemisphere mode
The Intel® Xeon® E7 family and 7500 series processor architectures incorporate Hemisphere mode, a
high-performance interleaving technology. Hemisphere mode combines the tracking resources of both
memory controllers within each processor for a more aggressive cache line pipelining.
Hemisphere mode is enabled when processors in the system have identical DIMM populations behind both
of their memory controllers. Observe the following guidelines:
• Hemisphere mode is controlled via an RBSU option, enabling the user to select either automatic (default)
or disable.
• In automatic mode, the BIOS enables Hemisphere mode if the system memory configuration is
compatible with Hemisphere mode.
• Hemisphere mode should produce the best overall performance for a variety of applications. However,
Hemisphere mode can be disabled if it produces lower performance for a particular application.
• To enable each processor to enter Hemisphere mode, all memory controllers must be installed and
populated with equal memory capacities based on the DIMM installation guidelines (on page 49).
• Greater performance is obtained when all memory controllers are populated with either four or eight
dual- or quad-rank DIMMs.
• Mirrored Memory mode is not supported when Hemisphere mode is enabled.
- User Guide 1
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- SAS and SATA hard drive LEDs 8
- Item Description 10
- System maintenance switch 11
- Interposer board components 12
- DIMM slot locations (A-side) 13
- DIMM slot locations (B-side) 14
- HP c-Class Blade SUV Cable 14
- Item Connector Description 15
- Operations 16
- Remove the server blade 17
- Remove the left DIMM baffle 19
- Remove the right DIMM baffle 20
- (A-side) 21
- (B-side) 22
- Remove the interposer board 23
- Remove the battery pack 24
- Overview 26
- Remove the device bay blank 27
- Setup 28 28
- Setup 30 30
- Installing a server blade 32
- Completing the configuration 33
- Introduction 34
- Processor option 34
- Memory option 47
- Dual- and quad-rank DIMMs 48
- DIMM identification 48
- DIMM installation guidelines 49
- Channel Slot Slot number 51
- Hemisphere mode 52
- Memory RAS 54
- HP Memory Quarantine 56
- Installing DIMMs (A-side) 57
- Installing DIMMs (B-side) 58
- Remove the hard drive blank 60
- Prepare the hard drive 60
- Mezzanine card option 61
- Controller options 65
- Installing a cache module 66
- Installing a capacitor pack 67
- BitLocker™ enabled 70
- Additional TPM features 71
- Cabling 72
- Network-based PXE deployment 75
- Deployment overview 76
- Deployment infrastructure 76
- Deployment methods 77
- PXE deployment 78
- CD-ROM deployment 78
- Diskette image deployment 79
- SAN configuration 80
- Configuration tools 81
- HP ROM-Based Setup Utility 82
- Boot options 83
- BIOS Serial Console 83
- Configuring AMP modes 83
- Array Configuration Utility 84
- Management tools 85
- Erase Utility 86
- Redundant ROM support 86
- Internal SD support 87
- Diagnostic tools 88
- Keeping the system current 89
- Version control 90
- ProLiant Support Packs 90
- Firmware 90
- HP Smart Update Manager 90
- Care Pack 91
- Troubleshooting 92
- Symbols on equipment 93
- Warnings 93
- Symptom information 94
- Troubleshooting 95 95
- Loose connections 96
- Service notifications 96
- Server health LEDs 96
- Troubleshooting flowcharts 96
- Start diagnosis flowchart 97
- General diagnosis flowchart 98
- Symptoms: 100
- POST problems flowchart 102
- OS boot problems flowchart 104
- • Corrupted OS 105
- • Redundancy failure 107
- (http://www.hp.com/support) 108
- Troubleshooting 109 109
- System battery 110
- FCC rating label 111
- Class A equipment 111
- Class B equipment 111
- Modifications 112
- • EMC Directive 2004/108/EC 113
- Japanese notice 114
- BSMI notice 114
- Korean notice 114
- Chinese notice 115
- Laser compliance 115
- Battery replacement notice 115
- Wireless devices 116
- Japanese notices 117
- Taiwan notices 117
- Electrostatic discharge 118
- Specifications 119
- Technical support 120
- Technical support 121 121
- Customer Self Repair 122
- Technical support 123 123
- Reparo feito pelo cliente 124
- Technical support 125 125
- Technical support 126 126
- Technical support 127 127
- Acronyms and abbreviations 128
- Index 131 131
- Index 132 132
- Index 133 133
- Index 134 134
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